As smaller footprint, higher functioning devices become the norm, stacked die technology will be required to enable the advancement of modern, integrated packages. Niche-Tech Die Attach Adhesive has developed to the needs of high-reliability, small die size and high power lead-frame applications for Chip On Board (COB) applications.
Our product offers the high adhesion, excellent reliability, outstanding dispensing performance and the highest electrical and thermal conductivity in any organic based system.

Also, have the characteristics of high consistency properties of fast curing, superior adhesive strength, lead-free capability and good performance in high speed dispensing without tailing.