Copper Alloy Bonding Wire
After long process of research and experiments Niche-tech successfully developed a copper alloy bonding wire by evenly mixing appropriate doping into 5N pure Copper. The alloy wire process is more environmental friendly, lower cost with similar reliability in compare to the Pd coated copper wire. In addition, the Alloy wire having a better anti-chlorine and anti-electrical fatigue properties.
Niche-tech Copper Alloy-solution for low cost high reliable bonding
Composite of Cu, Pd, Au and other metals- - Pd and other metals evenly distribute into the 5N purity Copper
- - Pd and other metals restrain oxidation, improve high temperature high humidity ball lift problem
- - Pd and other metals improve temperature cycling and reliability
- - Pd and other metals evenly distributed helps IMC growth
- - Alloy’s short HAZ length property enable low loop bonding curve
- - Enable low bonding loop
- - Improve first bond ball lift problem
- - Improve 2nd bond stability
- - Improve electrical fatigue
- - Lower cost
