Gold Bonding Wire
Niche-tech gold bonding wire has excellent electrical conductivity and high reliability. It good bond ability allows high speed bonding and can be used in all kinds of reliable semi-conductors packaging like: LED, QFP, SIP, DIP, BFA and FBGA
Features
- Stable bonding wire's and FAB ball's shape
- High bonding strength
- Good inter metallic compound (IMC) growth
Features
- Stable bonding wire's and FAB ball's shape
- High bonding strength
- Good inter metallic compound (IMC) growth
Stable Bonding Shape
Excellent Bonding Strength
Good High Temperature Storage Life
