Gold Alloy Bonding Wire
Niche-Tech gold alloy bonding wire has smaller squashed ball, good electrical conductivity and excellent bonding reliability. It can be used on conventional ball bonders machines. It can be applied in various types of package design such as LED, DIP, SIP, QFP, BGA and FBGA.
G02 & G03 Workability and RA Perfromance
Stable in bonding process. Distribution of grain is even
