Semiconductor Packaging
IC Packaging with Copper Bonding Wire
IC Packaging 2D Cross-section
The electronics market sector is increasingly driven by consumer spending, where electronic products require more than performance and speed. Product look and feel, functionality, time to market, and cost are becoming critical factors; and Semiconductor Packaging plays major role in delivering solutions to meet these needs. Consumer electronics are changing how semiconductor devices are thinned, die attached, bonding wire and encapsulated, with materials playing a major role enabling the development of newer packaging technologies. Advancements and changes continue in the semiconductor packaging materials market to meet performance and reliability requirements. Niche-Tech advance materials will provide solutions for the industry as devices fabricated with advance technologies are introduced to the market.
QFP
BGA
SOIC
PLCC
PRODUCT APPLICATIONS
Electronic Device

SMT Assembly

Component

Cross-section Diagram

Ball Bonding

Material - Cu Bonding Wire