Chip On Board
PCB application
COB 2D Cross-section
COB was first used in applications such as digital clocks and watches where a single chip per board is used. Since then its use has spread and it is now widely used in areas such as video cameras, pocket calculators, telephone cards and smart cards. It is also used increasingly in more complex assemblies such as printer modules, medical devices and sophisticated data processing circuits such as the computer server. Today state-of-the-art multi-chip COB systems with over 100 chips on a single board have been developed and COB is being used to produce most of the electronic assemblies in entertainment equipment. Niche-Tech Glob Top Epoxy is a high purity liquid epoxy designed for use as a glob top for Chip On Board (COB) applications, is an ideal encapsulation material for bare die and wire bonds in COB.
LCD Module
SD Memory Card
SIM Card
PCBA
PRODUCT APPLICATIONS
Electronic Device

Finished Product - SD Memory Card

After Cured

Waiting for Glob Top coating

Ultrasonic Wire Bonding Process

Material - AlSi Bonding Wire + Glob Top Epoxy